# Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer

> Imec, ASML, and TSMC have integrated both n-type and p-type transistors with atomically thin 2D channels on a single 300mm wafer at a 50nm contacted poly pitch, the tightest pitch demonstrated to date for complementary…

- **Source:** [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/imec-asml-and-tsmc-build-complementary-2d-material-transistors-at-50nm-pitch-on-a-300mm-wafer?utm_source=gearopen.com&utm_medium=referral&utm_campaign=feed&utm_content=6a3827fee8976fcb37cdfd64)
- **Published:** 2026-06-21
- **Category:** Gaming
- **Tags:** #intel
- **Canonical:** http://localhost:4321/a/6a3827fee8976fcb37cdfd64

---

_GearOpen's distilled summary. The full original article is published at Tom's Hardware (source link above); GearOpen does not republish the source's full text._