# Researchers turn HBM on its side to tackle AI memory’s heat wall — Korean V-Die and Japanese MOSAIC designs promise higher bandwidth, denser stacks, and cooler future GPUs

> Researchers in Korea and Japan have presented two separate memory-integration proposals that aim to increase HBM (High-Bandwidth Memory) capacity and bandwidth without trapping more heat inside ever-taller DRAM (Dynamic…

- **Source:** [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/researchers-turn-hbm-on-its-side-to-tackle-ai-memorys-heat-wall-korean-v-die-and-japanese-mosaic-designs-promise-higher-bandwidth-denser-stacks-and-cooler-future-gpus?utm_source=gearopen.com&utm_medium=referral&utm_campaign=feed&utm_content=6a50e321ffca446919840dfd)
- **Published:** 2026-07-10
- **Category:** Computers & IT
- **Tags:** #ai
- **Canonical:** http://localhost:4321/a/6a50e321ffca446919840dfd

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