# Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies

> This week, Samsung presented its vision for next-generation memory and storage solutions both for AI and general-purpose applications at the Future of Memory and Storage (FMS) 2026 conference.

- **Source:** [Tom's Hardware](https://www.tomshardware.com/pc-components/dram/samsung-debuts-three-next-generation-memory-technologies-for-ai-data-centers-zhbm-znand-o-and-bv-nand-all-rely-on-advanced-wafer-bonding-technologies?utm_source=gearopen.com&utm_medium=referral&utm_campaign=feed&utm_content=6a74a5d0afd40013a6d50913)
- **Published:** 2026-08-06
- **Category:** Computers & IT
- **Tags:** #samsung #ai
- **Canonical:** http://localhost:4321/a/6a74a5d0afd40013a6d50913

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