# GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion

> GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging technology.

- **Source:** [Tom's Hardware](https://www.tomshardware.com/tech-industry/semiconductors/globalfoundries-to-produce-silicon-interposers-for-tsmcs-cowos-in-the-us-five-year-agreement-valued-at-usd2-billion?utm_source=gearopen.com&utm_medium=referral&utm_campaign=feed&utm_content=6ac808a162b29e0b0580e751)
- **Published:** 2026-10-08
- **Category:** AI & Bots
- **Tags:** #ai
- **Canonical:** http://localhost:4321/a/6ac808a162b29e0b0580e751

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